According to industry sources cited by Digitimes, ASE is to start orders of fan-out wafer-level packaging (FOWLP) for Qualcomm, MediaTek and HiSilicon by end 2016.
ASE will be able to produce about 20,000 wafers monthly with its FOWLP technology at its Kaohsiung plant.
TSMC is already capable of fabricating wafers with its in-house developed FOWLP technology, as a competitor of ASE in high end packaging segment, who is reportedly, provides its FOWLP technology for Apple’s A10 processors.
TSMC’s backend integrated fan-out (InFO) WLP technology has already been adopted by many of its foundry customers, and is set to generate revenues of more than US$100 million in the fourth quarter of 2016.
(http://insemicon.com/)
ASE to start mass production of fan-out wafer-level packaging