According to industry sources cited by Digitimes, ASE is to start orders of fan-out wafer-level packaging (FOWLP) for Qualcomm, MediaTek and HiSilicon by end 2016. ASE will be able to produce about 20,000 wafers monthly with its FOWLP technology at
Apple Reports Strong Fiscal 4th Quarter Earnings
Apple reported $46.9 billion in net income and diluted earnings per share of $1.67. Gross margin was 38% for the quarter compared to 39.9% in the year-ago quarter. While these values were slightly lower compared to the fiscal fourth quarter
Samsung Foundry Announces 10nm SoC In Mass-Production
Samsung announced mass production of a SoC built on its third-generation 10nm “10LPE” process, as the first coming in the industry. The company said that compared to the 14-nanometer process, performance increase was 27 percent while energy consumption was 40
Strategy Analytics：Global 1H16 smartphone AP market grows 3% while tablet AP sector declines
According to Strategy Analytics, global smartphone application processor (AP) market grew 3% on year to US$10 billion in 1H16, while the tablet AP sector declined 34% to US$889 million. Qualcomm still topped the smartphone AP market with 39% revenue share,
Qualcomm Tips 28 GHz 5G Chip
Qualcomm announced plans for a 28 GHz modem that will be used in separate pre-standard 5G cellular trials by Verizon and Korea Telecom. The Snapdragon X50 delivers 5 Gbits/second downlinks and multiple gigabit uplinks for mobile and fixed-wireless networks. It