According to industry sources cited by Digitimes, ASE is to start orders of fan-out wafer-level packaging (FOWLP) for Qualcomm, MediaTek and HiSilicon by end 2016. ASE will be able to produce about 20,000 wafers monthly with its FOWLP technology at
According to industry sources cited by Digitimes, ASE is to start orders of fan-out wafer-level packaging (FOWLP) for Qualcomm, MediaTek and HiSilicon by end 2016. ASE will be able to produce about 20,000 wafers monthly with its FOWLP technology at